A*STAR backs GlobalFoundries in chip packaging R&D push in Singapore

A*STAR backs GlobalFoundries in chip packaging R&D push in Singapore
Image Credits: A*STAR

And strengthen local talent pipeline.

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Singapore’s lead public sector R&D agency, Agency for Science, Technology and Research (A*STAR) is collaborating with GlobalFoundries (GF) to enhance innovation in advanced semiconductor packaging.

Under a new memorandum of understanding, A*STAR will provide GF with access to its R&D facilities, capabilities, and technical support.

GF will contribute critical equipment to support A*STAR’s R&D efforts.

The collaboration aims to accelerate the development of compact, high-performance, and energy-efficient chip packaging solutions.

A*STAR Institute of Microelectronics, executive director, Terence Gan, said the agency will work with GlobalFoundries to accelerate innovation and talent development in advanced packaging technologies.

Workforce development is also a key focus.

A*STAR and GF will implement training initiatives to upskill GF employees in advanced packaging, supporting talent development and continuous learning.

The collaboration builds on GF’s earlier plan to create a new Advanced Packaging and Photonics Center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.

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