Micron Technology has announced US$24 billion (S$32 billion) investment to build an advanced NAND memory wafer fabrication facility within its existing Singapore manufacturing complex.
The 10-year project, expected to begin wafer production in the second half of 2028, aims to meet surging demand for NAND memory chips.
The company said the new facility will provide 700,000 square feet of cleanroom space and will be designed as a double-story wafer fab, supporting advanced NAND manufacturing and future technology transitions.
The new fab will integrate with Micron’s NAND Centre of Excellence in Singapore, providing capacity for continued technology transitions and advanced storage solutions.
“Micron’s leadership in advanced memory and storage is enabling the AI-driven transformation reshaping the global economy,” said Manish Bhatia, executive vice president of global operations at Micron Technology.
“We are grateful for the longstanding support and successful partnership with the Singapore government, including EDB and JTC. This investment underscores Micron’s long-term commitment to Singapore as an important hub in our global manufacturing network, enhancing supply chain resiliency and fostering a vibrant ecosystem for innovation,” he added.
Micron’s ongoing expansion also includes a high-bandwidth memory (HBM) advanced packaging facility in the same complex, which is on track to contribute to HBM supply in 2027.
The company anticipates synergies between NAND and DRAM production as part of its Singapore operations and will maintain flexibility in scaling capacity to meet market demand.
It added that the investment is expected to create roughly 1,600 new jobs, bringing the total number of positions added in the region to about 3,000 when combined with roles from the HBM facility.
This new announcement follows Micron’s decision last month to shift its focus away from the consumer memory and storage market toward serving AI data centre customers.
