Micron Technology has announced its plan to build a high-bandwidth memory (HBM) advanced packaging facility in Singapore to meet the demands of AI growth.
The company will invest US $7 billion (SG$9.5 billion) for the plant to expand its manufacturing capacity.
It is expected to begin operations in 2026.
This will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future.
Micron’s president and CEO, Sanjay Mehrotra, said, “As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly.”
“With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead,” Mehrotra added.m
Micron’s future expansion plans in Singapore will also support long-term manufacturing requirements for NAND.
This shift highlights a growing trend among chipmakers expanding their presence in Southeast Asia to reduce dependence on China and Taiwan, driven by persistent US-China tensions.
