India’s government has approved three new semiconductor units, including the country’s first chip fabrication unit in the western Indian state of Gujarat.
The other two include the semiconductor ATMP (assembly, testing, marking, and packaging) unit and the ATMP unit for specialised chips.
It will see a US$15 billion (S$ 20.19 billion) investment in establishing three plants.
India's Electronics & Information Technology Minister, Ashwini Vaishnaw, said all three units will start construction within the next 100 days.
The plants are approved under the 'Development of Semiconductors and Display Manufacturing Ecosystems in India' initiative.
Tata Electronics Private Limited will set up a semiconductor fab in partnership with Taiwan's Powerchip Semiconductor Manufacturing Corp (PSMC).
The facility will come up with an investment of US$11 billion (S$14.80 billion)
Viashnaw added that the plant will have a capacity of 50,000 wafers per month.
Once the plant reaches full capacity, 48 million chips per day will be produced from the unit, he added.
PSMC is known for its expertise in logic and memory foundry segments and has six semiconductor foundries in Taiwan.
Tata Electronics’ CEO and MD, Randhir Thakur said the partnership with PSMC provides access to a broad technology portfolio in leading edge and mature nodes including 28nm (nanometer), 40nm, 55nm, 90nm and 110nm and collaboration for high volume manufacturing.
The chips will provide applications for power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the demand in markets including automotive, computing and data storage, wireless communication and artificial intelligence.
It will generate over 20,000 direct and indirect skilled jobs in the region.
Two additional semiconductor units
Tata Semiconductor Assembly and Test Pvt Ltd (TSAT) will set up a greenfield semiconductor assembly and test facility in the northeastern Indian state of Assam.
48 million chips per day will be manufactured from here.
The company will build the facility focusing on three key platform technologies - Wire Bond, Flip Chip, and a differentiated offering called Integrated Systems Packaging (ISP), with plans to expand the roadmap to advanced packaging technologies in the future.
Under the partnership, TSAT is developing advanced semiconductor packaging technologies including flip chip and ISIP technologies.
The facility will be built with an investment of US$3.28 billion and is expected to generate over 27,000 direct and indirect jobs in the region.
According to Tata, Assam was chosen for the location of this plant as it is closer to the current semiconductor packaging and test hubs in Singapore, Taiwan, Malaysia and Vietnam.
It will serve the global demands for market segments including AI, industrial, and consumer electronics, the company added.
With an investment of nearly US$1 billion, another ATMP will be set up by CG Power with Japan's Renesas Electronics Corporation and Thailand's Stars Microelectronics in Gujarat.
The semiconductor unit will manufacture chips for consumer, industrial, automotive and power applications, with a capacity of 15 million chips per day.
Currently, Renesas operates 12 semiconductor facilities and is an important player in microcontrollers, analogue, power, and system-on-chip (SoC) products.
