iTnews Asia
  • Home
  • News
  • Hardware

IBM partners with Japan's Rapidus to make advanced chips

IBM partners with Japan's Rapidus to make advanced chips

To manufacture IBM's 2-nanometer chips.

By Tim Kelly and Jane Lanhee Lee on Dec 13, 2022 3:08PM

IBM Corp and Rapidus, a newly-formed chip maker backed by the Japanese government, on Tuesday announced a partnership that aims to manufacture the world's most advanced chips in Japan by the second half of the decade.

The agreement comes as US-China relations remain tense, especially over chips. Washington has restricted Beijing's access to advanced semiconductor technology and asked its allies, including Japan, to do the same.

Japan, which long ago lost its lead on chip manufacturing, particularly advanced semiconductors, is rushing to catch up and ensure its carmakers and information technology companies do not run short of the key component.

"It will take several trillions of yen," to get pilot production up and running, Rapidus president Atsuyoshi Koike said at a news conference in Tokyo. He didn't say where the money would come from, or where in Japan it would build a foundry.

Last month Japan's industry and trade ministry said it would invest an initial 70 billion yen (S$677 million) in Rapidus, a venture led by tech firms including Sony Group Corp and NEC Corp.

Although that is small in the world of chip manufacturing, where plants can cost tens of billions of dollars, sources say more investments are on the way.

IBM's director of research, Dario Gil, said the two companies would work together to manufacture IBM's 2-nanometer-node chips, unveiled last year.

A "nanometer," or one-billionth of a meter, in the chip industry, refers to a specific technology rather than the measurement.

In general, the smaller the number that precedes the word "nanometer," the more advanced the chip.

Asked whether Japan could leapfrog to manufacturing such advanced technology when its most advanced plant today makes a 40-nanometer chip, Gil said, “It’s not like you’re starting from scratch.”

As part of their agreement, Rapidus scientists and engineers will work alongside IBM Japan and IBM researchers at the Albany NanoTech Complex in New York state.

To reach the editorial team on your feedback, story ideas and pitches, contact them here.
Copyright Reuters
© 2019 Thomson Reuters. Click for Restrictions.
Tags:
2nanmeter chips hardware ibm rapidus

Related Articles

  • A*STAR backs GlobalFoundries in chip packaging R&D push in Singapore
  • The future of printing: How Epson’s business inkjet drives sustainability and efficiency
  • Indonesia’s Gramedia enhances retail operations with RFID technology
  • Micron to build semiconductor packaging facility in Singapore
Share on Twitter Share on Facebook Share on LinkedIn Share on Whatsapp Email A Friend

Most Read Articles

Malaysia's MYDIN streamlines warehouse operations

Malaysia's MYDIN streamlines warehouse operations

Indonesia Immigration automates border control for passengers

Indonesia Immigration automates border control for passengers

Texas Instruments expands existing footprint in Malaysia

Texas Instruments expands existing footprint in Malaysia

Micron to build semiconductor packaging facility in Singapore

Micron to build semiconductor packaging facility in Singapore

All rights reserved. This material may not be published, broadcast, rewritten or redistributed in any form without prior authorisation.
Your use of this website constitutes acceptance of Lighthouse Independent Media's Privacy Policy and Terms & Conditions.