iTnews Asia
  • Home
  • News
  • Hardware

SK Hynix says has developed 238-layer Nand flash chip

SK Hynix says has developed 238-layer Nand flash chip

Beats Micron's 232-layer announcement.

By Staff Writer on Aug 3, 2022 12:07PM

South Korea's SK Hynix Inc has developed its most advanced NAND flash chip made up of 238 layers of memory cells for use in PC storage devices and later smartphones and servers, the world's second-largest memory chip maker said on Wednesday.

SK Hynix described it as the "industry's highest" NAND flash chip and it follows US rival Micron Technology Inc saying last week it had begun shipping a 232-layer NAND chip.

SK Hynix said the new 238-layer chip is the smallest NAND flash chip in size, boasts a 50 percent improvement in data transfer speed over previous generation chips and power efficiency as well, as it cuts the volume of energy consumed for data reading by 21 percent.

The company plans to start mass production of the chip in the first half of 2023.

SK Hynix and Solidigm, the new name of Intel's NAND business which SK acquired, hold a combined 18 percent share of the NAND flash market, behind Samsung Electronics with 35.3 percent and Kioxia with 18.9 percent, according to first-quarter data from TrendForce.

 

To reach the editorial team on your feedback, story ideas and pitches, contact them here.
Copyright Reuters
© 2019 Thomson Reuters. Click for Restrictions.
Tags:
hardware micron sk hynix

Related Articles

  • A*STAR backs GlobalFoundries in chip packaging R&D push in Singapore
  • The future of printing: How Epson’s business inkjet drives sustainability and efficiency
  • Indonesia’s Gramedia enhances retail operations with RFID technology
  • Micron to build semiconductor packaging facility in Singapore
Share on Twitter Share on Facebook Share on LinkedIn Share on Whatsapp Email A Friend

Most Read Articles

Malaysia's MYDIN streamlines warehouse operations

Malaysia's MYDIN streamlines warehouse operations

Micron to build semiconductor packaging facility in Singapore

Micron to build semiconductor packaging facility in Singapore

Infineon expanding semiconductor manufacturing in Indonesia

Infineon expanding semiconductor manufacturing in Indonesia

SC Capital Partners to build US$500m data centre in South Korea

SC Capital Partners to build US$500m data centre in South Korea

All rights reserved. This material may not be published, broadcast, rewritten or redistributed in any form without prior authorisation.
Your use of this website constitutes acceptance of Lighthouse Independent Media's Privacy Policy and Terms & Conditions.